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Showing 29–56 of 119 results

  • High-Performance

    HP-127-1.0-1.3-71

    $21.70$23.00

    High Performance modules have one of two features that set them apart from our standard devices. Some achieve a higher temperature difference (DTmax) through the use of premium quality thermoelectric material. Others have more heat pumping capacity (Qmax) for any given size through the use of shorter thermoelectric elements or higher element packing densities. The higher DTmax is useful for reducing power consumption and achieving ultimate performance when you need a high temperature from the cold plate to the heat sink. Higher Qmax modules are useful for reducing the module count and improving the C.O.P. in systems that have lower temperature differences. These modules are rated for use up to 80°C.

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  • Micro

    TE-109-0.6-0.8

    $39.50$40.80

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-65-0.6-0.8

    $31.40$32.70

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-31-0.6-0.8

    $22.70$24.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-65-0.6-1.0

    $31.50$32.80

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-35-0.6-1.0

    $23.20$24.50

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-31-0.6-1.0

    $22.50$23.80

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-17-0.6-1.0

    $19.70$21.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-11-0.6-1.0

    $18.00$19.30

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-7-0.6-1.0

    $17.70$19.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-65-0.6-1.2

    $31.80$33.10

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-35-0.6-1.2

    $23.40$24.70

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-31-0.6-1.2

    $22.50$23.80

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-17-0.6-1.2

    $19.70$21.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-11-0.6-1.2

    $18.00$19.30

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-7-0.6-1.2

    $17.70$19.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-65-0.6-1.5

    $31.90$33.20

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-35-0.6-1.5

    $23.70$25.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-31-0.6-1.5

    $22.80$24.10

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-17-0.6-1.5

    $19.80$21.10

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-11-0.6-1.5

    $18.30$19.60

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-7-0.6-1.5

    $17.70$19.00

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-66-0.45-1.3

    $37.20$38.50

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-32-0.45-1.3

    $27.90$29.20

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-18-0.45-1.3

    $25.30$26.60

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-12-0.45-1.3

    $23.40$24.70

    Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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  • Micro

    TE-8-0.45-1.3

    $22.50$23.80

    Standard modules offer the highest quality in the industry with excellent thermal performance. Our proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80 C. Parameters of Category: Micro Modules Imax 0.7 amp(s) Qmax 0.4 watt(s) Vmax 1 volt(s) DT max 67 Th=300K A […]

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  • Standard

    TE-32-2.8-1.5

    $29.50$30.80

    Standard modules offer the highest quality in the industry with excellent thermal performance. Our proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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