TE-109-0.6-0.8

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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Quantity   Price
Variation Type: Unpotted
Out of Stock
1 - 9 $39.50
10 - 24 $36.90
25 - 99 $36.20
100+ Please Call
Variation Type: Potted
Out of Stock
1 - 9 $40.80
10 - 24 $38.20
25 - 99 $37.50
100+ Please Call

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Parameters of Category: Micro Modules
Imax 2.1 amp(s)
Qmax 16.9 watt(s)
Vmax 13.4 volt(s)
DT max 68 Th=300K
A 12 mm
B 12 mm
C 26 mm
D 26 mm
H 2.55 mm

Specification Sheet
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Compatible With:

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