Micro Modules

Standard modules offer the highest quality in the industry with excellent thermal performance. Our proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80 C. Parameters of Category: Micro Modules Imax 0.7 amp(s) Qmax 0.4 watt(s) Vmax 1 volt(s) DT max 67 Th=300K A […]

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.