TE-31-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology's proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

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Dynamic Pricing
Quantity   Price
Variation Type: Unpotted
1 - 9 $22.50
10 - 24 $20.00
25 - 99 $19.30
100+ Please Call
Variation Type: Potted
1 - 9 $23.80
10 - 24 $21.30
25 - 99 $20.60
100+ Please Call

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

Parameters of Category: Micro Modules
Imax 1.7 amp(s)
Qmax 3.9 watt(s)
Vmax 3.8 volt(s)
DT max 69 Th=300K
A 8 mm
B 8 mm
C 8 mm
D 8 mm
H 2.75 mm

Specification Sheet
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Compatible With:

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