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Peltier - Thermoelectric Cooler Modules
Showing 33–48 of 122 results
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QuickviewTE-31-0.6-0.8
$22.70 – $24.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-65-0.6-1.0
$31.50 – $32.80 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-35-0.6-1.0
$23.20 – $24.50 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-31-0.6-1.0
$22.50 – $23.80 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-17-0.6-1.0
$19.70 – $21.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-11-0.6-1.0
$18.00 – $19.30 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-7-0.6-1.0
$17.70 – $19.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-65-0.6-1.2
$31.80 – $33.10 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-35-0.6-1.2
$23.40 – $24.70 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-31-0.6-1.2
$22.50 – $23.80 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-17-0.6-1.2
$19.70 – $21.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-11-0.6-1.2
$18.00 – $19.30 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-7-0.6-1.2
$17.70 – $19.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-65-0.6-1.5
$31.90 – $33.20 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-35-0.6-1.5
$23.70 – $25.00 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.
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Quickview
TE-31-0.6-1.5
$22.80 – $24.10 Select optionsProduct DetailsQuick ViewMicro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.