Peltier - Thermoelectric Cooler Modules

Showing 33–48 of 121 results

Sale!
TE-31-0.6-0.8

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-65-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-35-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$29.20 – $35.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-31-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-17-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-11-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-7-0.6-1.0

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-65-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$40.60 – $46.30 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-35-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-31-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-17-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-11-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-7-0.6-1.2

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-65-0.6-1.5

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$40.90 – $46.60 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-35-0.6-1.5

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details
Sale!
TE-31-0.6-1.5

Micro modules are devices that have semiconductor element footprints of less than 1.0mm square, allowing higher numbers of couples for a given size module. These modules are metallized (but not solder tinned) on both hot and cold surfaces and they are suitable for mounting with solder or via compression (compression is recommended). TE Technology’s proprietary “potting” for moisture protection and ruggedizing is available as an option. These modules are rated for use up to 80°C.

$0.00 Select options This product has multiple variants. The options may be chosen on the product page Product Details

Search Products

Peltier - Thermoelectric Cooler Modules

TE-31-0.6-0.8

TE-65-0.6-1.0

TE-35-0.6-1.0

TE-31-0.6-1.0

TE-17-0.6-1.0

TE-11-0.6-1.0

TE-7-0.6-1.0

TE-65-0.6-1.2

TE-35-0.6-1.2

TE-31-0.6-1.2

TE-17-0.6-1.2

TE-11-0.6-1.2

TE-7-0.6-1.2

TE-65-0.6-1.5

TE-35-0.6-1.5

TE-31-0.6-1.5