The HP-127-1.4-2.5-72 uses 72°C DT max material and is a low heat flux cooling module typically operated at about 12VDC in the cooling mode. The low heat flux reduces temperature gradients across the thermal interfaces to the modules, and reduces temperature gradients within the heat sink. These, in turn, reduce the operating temperature difference across the module so the device is operating at a more efficient point. The tall semiconductor element height of 2.5mm makes the module thicker, which also reduces the heat transferred from a hot heat sink to a colder cooling plate. That makes it easier to achieve the expected cooling results since many designers underestimate these effects.
High Performance modules have one of two features that set them apart from our standard devices. Some achieve a higher temperature difference (DTmax) through the use of premium quality thermoelectric material. Others have more heat pumping capacity (Qmax) for any given size through the use of shorter thermoelectric elements or higher element packing densities. The higher DTmax is useful for reducing power consumption and achieving ultimate performance when you need a high temperature from the cold plate to the heat sink. Higher Qmax modules are useful for reducing the module count and improving the C.O.P. in systems that have lower temperature differences. These modules are rated for use up to 80°C.
